Loctite CSP、Flip Chip專用液態底部填膠，不僅提供了無可比擬的流動性及固化速度，可靠性超過了市場的要求。新開發的Flux Fill型底部填膠，可使底部填充膠在迴焊過程中同時固化。樂泰與多所大學合作，共同著手於開發晶片級的可重工和Flux Fill型的底部填膠，滿足覆晶的直接貼裝。

• 高純度液態環氧樹脂，點膠容易
• 流動性良好，快速固化
• 耐久性優異，Tg點高，可達攝氏160℃
• 抗化學腐蝕、耐溫度變化、耐衝擊
• 增強電子製成品的可靠性
• 可重工
• 下填膠材於迴焊過程同時固化

Hysol® CSP and FCOB Underfills

PRODUCT

DESCRIPTION

APPLICATIONS

SPECIFIC GRAVITY

VISCOSITY/ (cp)

CURE SCHEDULE

Tg°C

CTE PPM/°C

TENSILE MOOULUS

CAPILLARY FLOW

STORAGE

TDS

3563

Snap cure rapid flow. CSP or FCOB

High-performance, high-reliability, tast-processing underfill. Desinged specifically for high-volume production of consumer electronics devices.

1.52

8,000

5 mins @150°C

130

35

400,000 psi

< 15 seconds+

-40°C

*FP4531

Fast flow, fast cure, high reliability

High-performance, high-reliability,tast-processing underfill. Designed specifically for polymide flex substrates and improved reliability on CSPs.

1.70

10,000

7 mins @165°C

144

28

7.6 Gpa*

25 seconds++

-40°C

3568

Reworkable CSP or FCOB

Reworkable, high reliability, tast-flowing underfill designed for polymid-passivated flip chip, CSP and uBGA assemblies.

1.30

11,000

5 mins @165°C

94

65

162,000 psi

30 seconds+

-40°C

3593

Snap cure rapid flow CSP

Extremely fast flowing, rapid cure underfill for high volume production speeds. Flowable in very small gaps. Black.

1.18

4,500

5 mins @150°C

110

50

300,000 psi

100 seconds++

5°C

*FP6100

Reworkable CSP

Reworkable underfill for CSP and uBGA assemblies. Easy rework and repair. Designed specifically for vibration and drop test resistance.

1.00

7,900

5 mins @165°C

0

94

42 Mpa

15 seconds++

-40°C