FLOWPRO
PERTIES

DESCRIPTION

APPLICATIONS

CURE
SCHEDULE

SPECIFIC
GRAVITY

VISCOSITY/
(CP)

Tg°C

CTE
PPM/°C

VOLUME
RESISIVITY

SURFACE
RESISTIVITY

STORAGE

TDS

Variable-Temperature Dependent

Variable Flow
Dam & Fill

Product has a unique rheology that allows the same product to be used as both a dam & fill encapsulant. When Heated (85-100°C).it performs as a flow control dam. When dispensed onto lower temperature (45-65°C)substrate, material flows and works like a fill encapsulant.

5 mins
@140°C

1.65

100,000

135

43

6.6 E15
Ω-CM

2.4x10 ¹⁷
Ω-CM

-40°C

LOW

Fast Cure, High
Performance

LOW CTE and high Tg. is specifically designed to provide the highest reliability in demanding COB, MCM, BGA ,and PGA encapsulating applications.

30 mins
@150°C

1.76

250,000

155

19

3.1 E15
Ω

2.4 x10 ¹⁶
Ω

-40°C

Medium

Fast Cure, High
Performance

LOW CTE and high Tg. is specifically designed to provide the highest reliability in demanding COB, MCM, BGA ,and PGA encapsulating application.

30 mins
@125°C
+
90 mins
@165°C

1.78

50,000

155

19

4.2 E15
Ω-CM

4.2 x10 ¹⁶
Ω

-40°C

High

High
Performance
Fill

High purity. High reliability for chip-on-board (plastic substrate) and plastic PGA applications.Excellent moisture and chemical resistance.

30 mins
@125°C
+
90 mins
@165°C

1.77

50,000

162

19

18 x10 ¹⁶
Ohms/cm

2.57 x10 ¹⁶
Ohms

-40°C

LOW

High
PerformanceDam

High purity. High reliability for chip-on-board (plastic substrate) and plastic PGA applications.Excellent moisture and chemical resistance.

30 mins
@125°C
+
90 mins
@165°C

1.77

860000

145

21

1.31 x10 ¹⁶
Ohms-cm

2..25 x10 ¹⁷
Ohms

-40°C

DESCRIPTION

APPLICATIONS

CURES
CHEDULE

SPECIFIC
GRAVITY

VISCOSITY/
(CP)

Tg°C

CTE
PPM/°C

VOLUME
RESISIVITY

SURFACE
RESISTIVITY

STORAGE

TDS

Easy Handling, Long pot life COB, Medium glob

For Applications requiring excellent handling properties. Particularly suited for use on transistors and similar semiconductors, and is wisely used for encapsulation of watch lCs.

10 mins
@150°C

1.56

70,000

115

46

6.6 E15
Ω-CM

1.0x10 ¹⁶
Ω-CM

4°C

Snap Cure, Long pot life

Fast cure glob encapsulant for plastic substrate applications.

5 mins
@140°C

1.74

270,000

125

25

3.7 E16
Ω-CM

3.3 x10 ¹⁷
Ω-CM

4°C

High Performance, one part frozen storage

Glob top encapsulant for transistors, smart cards, diodes, and IC in Chip-on-Board (COB) applications where potting wells/indentations are not provided.

30 mins
@150°C

1.8

70,000

155

19

3.0 E15
Ω-CM

2.0 x10 ¹⁶
Ω-CM

-40°C

Long pot life COB.Self leveling

Designed to pass 1000 hours of temperature/humidity/bias testing and thermal cycling up to 125°C

1 hours
@150°C

1.78

20,000

135

35

1.19E14
Ohms-CM

2.0 x10 ¹⁵
Ohms

10°C

Easy handling, long pot life COB, High glob

Designed to pass 1000 hours of temperature/humidity/bias testing and thermal cycling up to 125°C

1 hours
@150°C

1.78

160,000

135

35

1.19E14
Ohms-cm

2..0 x10 ¹⁴
Ohms

10°C

High temperature
cycle performance

Suitable for bare die protection in a variety of advanced packages such as IC memory cards, chip carriers, etc. Temperature and chemical resistance advantages for automotive applications.

3 hours
@170°C
6 hours
@150°C

1.78

375,000

160

22X
10 ^-6

1.0 x10 ¹⁴
Ohms-cm

1.3 x10 ¹⁶
Ohms