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产品名称: 相變型導熱片
产品编号: N200661911189
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发布日期: 2007-10-10
查看数次: 3311 次
产 品 详 细 介 绍
相變型導熱片
Phase Change Thermal Interface

 LOCTITE PCTIM相變型導熱片為今日高性能的微處理器散熱需求,提供了優異的熱傳導特性。這個革命性的新產品完全超越導熱膏的效能並且避免silicone的污染和流動。

 具有高觸變性特質的PCTIM是將相變型化合物塗佈於鋁層或絕緣體的兩面,在溫度變化時將呈現為最輕薄的導熱介質。

  • 不外溢、無揮發、高絕緣
  • 易貼用、易重工
  • 專利雙側式背膠
  • 100%貼合性,避免介面中的空氣影響熱傳導
  • 化合物成為液態後,將往垂直 方向膨脹體積約15%,主動擠 出間隙中的小氣泡
 
 
产品性能

Phase Change Thermal Interface Material (PCTIM)

PRODUCT
CHARACTERISICS

POWERSTRATETM
51,.60

THERMSTRATE®
2000

ISOSTRALETM
2000

MCMTM_STRATE

EMITM_STRATE

THERMSTRATE®-
TC

POWERFILM

Product or Material Type

Die-Cut pre-form
PCTIM

Die-Cut
Pre-form PCTIM

Die-Cut
Pre-form PCTIM

Die-Cut Pre-form PCTIM:Compound
Side A: adhesive side B

Die-Cut multi-layer EMI
Shidle/PCTIM/electrical
Isolation pad

Phase-change
Compound applicator

Non-supported
Pre-form PCTIM

Compound coating
application

Two sides

Two sides

Two sides

Single side

Multiple coating layers

(Compound only)

(Compound only)

Electrically conductive
(note 1)

Yes

Yes

No

No

No

No

No

Thermal impedance
(°C-in.2/Watt)

0.008-0.010 @ 80PSI

0.022-0.038 @ 80PSI

0.12-0.29
@ 80PSI

(see data sheet)

0.4 @ 80PSI

0.021 @ 80PSI

0.008 to 0.025
@ 80PSI

Relative thermal performance

Highest*

High*

Medium*

Moderate*

Medium*

High*

Highest*

Thermal conductivity
(W/mk)

3

3

0.45

(see data sheet)

0.689

0.47

3.0

Phase change temperature

51°C or 60°C**

60°C

60°C

60°C

60°C

60°C

51°C

Dielectric rating

N/A

N/A

2200 to 1800
VAC/mil

2200 to 1800 VAC/mil

400 VAC/mil

N/A

N/A

UL approval-Yellow card

N/A

N/A

E104932

E104932

N/A

N/A

N/A

UL Flammability rating

N/A

N/A

94V-0

94V-0

(Not rated)

N/A

N/A

Shielding effectiveness @100KHz

N/A

N/A

N/A

N/A

60dB

N/A

N/A

Thickness, overall

0.00025”-0.0033”

0.003”-0.0075”

0.002”-0.004”

0.0035”

0.015”

0.0005”

0.0005”to 0.0030”**

Thickness, substrate

0.002”

0.002”, 0.005”

0.001”-0.003”

0.002”

(see data sheet)

N/A

N/A

Compound type

PowerstrateTM

Thermstrate®
2000

Thermstrate®
2000

Thermstrate®
2000

Thermstrate®
2000

Thermstrate®
2000

Powerstrate

Compound color

Black

White

White

White

White

White

Black

Substrate  type

AL- 1145-0

AL- 1145-0

Dupont®
KaptonTM MT

Dupont® KaptonTM MT

Dupont®KaptonTM
MT + copper

(None)

(None)

Substrate  color

Aluminum

Aluminum

Amber

Amber

Amber

N/A

N/A

Fist produced/
(original formulation)

2000

1998(1984)

1998(1986)

1998(1986)

1998/(1993)

1998/(1995)

2001

 

 

Standard tooling availability

Steel rule die

Yes

Yes

Yes

Yes

Yes

No

No

Rotary die

Yes

Yes

Yes

Yes

No

No

Yes

Available in high-volume rolls

Yes

Yes

Yes

Yes

No

N/A

Yes

Available in pre-applied format

Yes

Yes

Yes

Yes

No

N/A

Pre-heating required

Available in multi-pad cards

No

No

Yes

Yes

No

No

No

 

 

 

Appropriate applications 

Microprocessors

Best

Yes

No

No

No

Yes

Yes

Graphics processor
ASICs, DRAM

Best

Yes

No

No

No

Yes

Yes

IGBTs , discrete power
semiconductors

Yes

Best

Yes

Yes

Yes

Yes

Yes

Isolated base power
semiconductors

Yes

Best

No

No

No

Yes

Yes

DC-DC converters

Yes

Best

N/A

N/A

N/A

No

No

Telcom/wireless
discrete components

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Discrete  RF transistors

Best

Yes

No

No

No

Yes

Yes

Optoelectronics, laser diodes

Best

Yes

Yes

Yes

N/A

No

No

Large area applications
(>25 sq. in.)

Yes

Yes

Yes

Yes

No

No

No

*This relative thermal performance rating is intended to be a general guide within the family of products and materials offered by Power Devices, lnc
** Customer specified option
Note: ALL products are phase-change thermal interface materials (PCTM). Compounds are electrically non-conductive; substrate conductivity determines Overall product
Electrical conductivity.

  
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